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 CA3086
November 1996
General Purpose NPN Transistor Array
Description
The CA3086 consists of five general-purpose silicon NPN transistors on a common monolithic substrate. Two of the transistors are internally connected to form a differentially connected pair. The transistors of the CA3086 are well suited to a wide variety of applications in low-power systems at frequencies from DC to 120MHz. They may be used as discrete transistors in conventional circuits. However, they also provide the very significant inherent advantages unique to integrated circuits, such as compactness, ease of physical handling and thermal matching
Applications
* Three Isolated Transistors and One Differentially Connected Transistor Pair For Low-Power Applications from DC to 120MHz * General-Purpose Use in Signal Processing Systems Operating in the DC to 190MHz Range * Temperature Compensated Amplifiers * See Application Note, AN5296 "Application of the CA3018 Integrated-Circuit Transistor Array" for Suggested Applications
Ordering Information
PART NUMBER (BRAND) CA3086 CA3086M (3086) CA3086M96 (3086) CA3086F TEMP. RANGE (oC) -55 to 125 -55 to 125 -55 to 125 -55 to 125 PACKAGE 14 Ld PDIP 14 Ld SOIC 14 Ld SOIC Tape and Reel 14 Ld CERDIP PKG. NO. E14.3 M14.15 M14.15 F14.3
Pinout
CA3086 (PDIP, CERDIP, SOIC) TOP VIEW
1 Q5 2 3 Q2 4 Q4 5 6 7 Q3 Q1
14 13 SUBSTRATE 12 11 10 9 8
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 1999
File Number
483.3
5-27
CA3086
Absolute Maximum Ratings
The following ratings apply for each transistor in the device: Collector-to-Emitter Voltage, VCEO . . . . . . . . . . . . . . . . . . . . . 15V Collector-to-Base Voltage, VCBO . . . . . . . . . . . . . . . . . . . . . . 20V Collector-to-Substrate Voltage, VCIO (Note 1) . . . . . . . . . . . . 20V Emitter-to-Base Voltage, VEBO . . . . . . . . . . . . . . . . . . . . . . . . . 5V Collector Current, IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Thermal Information
Thermal Resistance (Typical, Note 2) JA (oC/W) JC (oC/W) CERDIP Package . . . . . . . . . . . . . . . . 150 75 PDIP Package . . . . . . . . . . . . . . . . . . . 180 N/A SOIC Package . . . . . . . . . . . . . . . . . . . 220 N/A Maximum Power Dissipation (Any one transistor). . . . . . . . . 300mW Maximum Junction Temperature (Hermetic Packages) . . . . . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. The collector of each transistor in the CA3086 is isolated from the substrate by an integral diode. The substrate (Terminal 13) must be connected to the most negative point in the external circuit to maintain isolation between transistors and to provide for normal transistor action. To avoid undesirable coupling between transistors, the substrate (Terminal 13) should be maintained at either DC or signal (AC) ground. A suitable bypass capacitor can be used to establish a signal ground. 2. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER
TA = 25oC, For Equipment Design SYMBOL V(BR)CBO V(BR)CEO V(BR)ClO V(BR)EBO ICBO ICEO hFE TEST CONDITIONS lC = 10A, IE = 0 IC = 1mA, IB = 0 IC = 10A, ICI = 0 IE = 10A, IC = 0 VCB = 10V, IE = 0, VCE = 10V, IB = 0, VCE = 3V, IC = 1mA MIN 20 15 20 5 40 TYP 60 24 60 7 0.002 (Figure 2) 100 MAX 100 5 UNITS V V V V nA A
Collector-to-Base Breakdown Voltage Collector-to-Emitter Breakdown Voltage Collector-to-Substrate Breakdown Voltage Emitter-to-Base Breakdown Voltage Collector-Cutoff Current (Figure 1) Collector-Cutoff Current (Figure 2) DC Forward-Current Transfer Ratio (Figure 3)
Electrical Specifications
PARAMETER
TA = 25oC, Typical Values Intended Only for Design Guidance TYPICAL VALUES 100 54 0.715 0.800 -1.9 0.23 V V mV/oC V
SYMBOL hFE VCE = 3V
TEST CONDITIONS IC = 10mA IC = 10A
UNITS
DC Forward-Current Transfer Ratio (Figure 3) Base-to-Emitter Voltage (Figure 4)
VBE
VCE = 3V
IE = 1 mA IE = 10mA
VBE Temperature Coefficient (Figure 5) Collector-to-Emitter Saturation Voltage Noise Figure (Low Frequency)
VBE/T VCE SAT NF
VCE = 3V, lC = 1 mA IB = 1mA, IC = 10mA f = 1kHz, VCE = 3V, IC = 100A, RS = 1k
3.25
dB
5-28
CA3086
Electrical Specifications
PARAMETER Low-Frequency, Small-Signal EquivalentCircuit Characteristics: Forward Current-Transfer Ratio (Figure 6) Short-Circuit Input Impedance (Figure 6) Open-Circuit Output Impedance (Figure 6) Open-Circuit Reverse-Voltage Transfer Ratio (Figure 6) Admittance Characteristics: Forward Transfer Admittance (Figure 7) Input Admittance (Figure 8) Output Admittance (Figure 9) Reverse Transfer Admittance (Figure 10) Gain-Bandwidth Product (Figure 11) Emitter-to-Base Capacitance Collector-to-Base Capacitance Collector-to-Substrate Capacitance yFE yIE yOE yRE fT CEBO CCBO CClO VCE = 3V, IC = 3mA VEB = 3V, IE = 0 VCB = 3V, IC = 0 VC l = 3V, IC = 0 hFE hIE hOE hRE f = 1MHz,VCE = 3V, lC = 1mA 31 - j1.5 mS TA = 25oC, Typical Values Intended Only for Design Guidance (Continued) TYPICAL VALUES
SYMBOL
TEST CONDITIONS f = 1kHz,VCE = 3V, IC = 1mA
UNITS
100
-
3.5
k S -
15.6 1.8 X 10-4
0.3 + j0.04 0.001 + j0.03 See Figure 10
mS mS -
550 0.6 0.58 2.8
MHz pF pF pF
Typical Performance Curves
102 COLLECTOR CUTOFF CURRENT (nA) COLLECTOR CUTOFF CURRENT (nA) IE = 0 10 VCB = 15V VCB = 10V VCB = 5V 103 102 VCE = 10V 10 VCE = 5V 1 10-1 10-2 10-3 0 25 50 75 100 125 0 25 TEMPERATURE (oC) 50 75 TEMPERATURE (oC) 100 125 IB = 0
1 10-1 10-2 10-3 10-4
FIGURE 1. ICBO vs TEMPERATURE
FIGURE 2. ICEO vs TEMPERATURE
5-29
CA3086 Typical Performance Curves
120 110 100 90 80 70 60 50 0.01 0.1 1 10 EMITTER CURRENT (mA) BASE-TO-EMITTER VOLTAGE (V) VCE = 3V TA = 25oC hFE
(Continued)
0.8
VCE = 3V TA = 25oC
STATIC FORWARD CURRENT TRANSFER RATIO (hFE)
0.7 VBE
0.6
0.5
0.4 0.01
0.1 1.0 EMITTER CURRENT (mA)
10
FIGURE 3. hFE vs IE
FIGURE 4. VBE vs IE
VCB = 3V NORMALIZED h PARAMETERS
100
VCE = 3V f = 1kHz TA = 25oC hIE
BASE-TO-EMITTER VOLTAGE (V)
0.9 0.8 0.7 0.6 0.5 0.4 -75 -50 -25 0 25 50 75 100 125 TEMPERATURE (oC) IE = 3mA IE = 1mA IE = 0.5mA
10
hFE = 100 hIE = 3.5k hRE = 1.88 x 10-4 hOE = 15.6S
hOE AT 1mA
hRE
1.0
hFE
hRE hIE 0.1 0.01 0.1 1.0 COLLECTOR CURRENT (mA) 10
FIGURE 5. VBE vs TEMPERATURE
FIGURE 6. NORMALIZED hFE, hIE, hRE, hOE vs IC
FORWARD TRANSFER CONDUCTANCE (gFE) AND SUSCEPTANCE (bFE) (mS)
INPUT CONDUCTANCE (gIE) AND SUSCEPTANCE (bIE) (mS)
40 30 20 10 0 -10 -20
COMMON EMITTER CIRCUIT, BASE INPUT TA = 25oC, VCE = 3V, IC = 1mA
6 5 4 3
COMMON EMITTER CIRCUIT, BASE INPUT TA = 25oC, VCE = 3V, IC = 1mA
gFE
bIE
2 gIE 1 0
bFE
0.1
1
10 FREQUENCY (MHz)
100
0.1
1
10 FREQUENCY (MHz)
100
FIGURE 7. yFE vs FREQUENCY
FIGURE 8. yIE vs FREQUENCY
5-30
CA3086 Typical Performance Curves
(Continued)
6 OUTPUT CONDUCTANCE (gOE) AND SUSCEPTANCE (bOE) (mS) 5 4
COMMON EMITTER CIRCUIT, BASE INPUT TA = 25oC, VCE = 3V, IC = 1mA
REVERSE TRANSFER CONDUCTANCE (gRE) AND SUSCEPTANCE (bRE) (mS)
COMMON EMITTER CIRCUIT, BASE INPUT TA = 25oC, VCE = 3V, IC = 1mA gRE IS SMALL AT FREQUENCIES LESS THAN 500MHz bRE
0
bOE 3 2 1 0 0.1 1 10 FREQUENCY (MHz) 100
-0.5 -1.0
-1.5 -2.0 1 10 FREQUENCY (MHz) 100
gOE
FIGURE 9. yOE vs FREQUENCY
FIGURE 10. yRE vs FREQUENCY
VCE = 3V GAIN BANDWIDTH PRODUCT (MHz) 1000 900 800 700 600 500 400 300 200 100 0 0 1 2 3 4 5 6 7 8 9 10 COLLECTOR CURRENT (mA) TA = 25oC
FIGURE 11. fT vs IC
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
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